BST-853A

Anti-static, wide range of temperature-adjustable desoldering system, accurate and intelligent temp control, easy to operate, with high-power big power far infrared heat module of 120mm*120mm. Heating fast. Unique thermal insulation design, the temperature of cover is low, so it increases preheating temperature range. Solder and desolder, both ok, suitable for assembling and disassembling large-area BGA chip and expansion slot of computer mainboard.

Operating instructions:
1. The preheating temperature range is 100℃-500℃. if for PCB preheating, suggest to set temperature at about 300℃. Ajust temperature as required, for longer life span, do not set it over 400℃.
2. This station can be used to desolder separatly, or combine with our 301 series work platform.
3. When "POWER" is switched to "ON" position, it has "cool"and "heat" options, set to "heat", it start to heat, set to "cool ", it starts to cool down. Press"UP" or "DOWN" to adjust temperature. The light will twinkle when reaches set temperature.
4. Adjust the PCB holder to match PCB size, make it fixed at the clip slot, or put the the part on the heating plate, put some solder flux on the pin of the chip, take it away after the solder tin melted.
5.when soldering by infrared heating, put tin-plate Chip pin pad or pin of PCB, also put some solder flux, which increases the soldering quality. Check it after finish soldering.
6.please clean the heat plate if it have much residues of flux, tin or dust . just screw out 8pcs of screws, and take barrier net away, then start to clean the heat plate.