Micro SD card no push connector(TF Card no push connector outside solder)

1. Material:

Insulator: Hi-Temperature Plastic UL 94V-0 Rated.

Contact: Copper Alloy.

2. Characteristics:

Current Rating: 0.5AM.

Dielectric Withstanding Voltage: AC500V r.m.s

Insulation Resistance:1000MΩ Min.

Mating Cyeles: 10000 insertions.

Card Push Insertion /our Force: 0.7 to 1.20kgf.

 

Normally use reel/ tape packing,1000pcs per reel, but we can do as for your need.

Delivery : 1-2 weeks around.