Detailed Product Description

BST-223-UV

BST-223-UV solder paste is used to rework PCB,BGA,PGA and other SMD.It's based on low ion activator system, with perfect efficiency of wetting tin,less smoke and high insulation resistance of odd parts after soldering.
BST-223 is middle-level rosin-activated solder paste, widely used for SMD rework.
BST-223-UV is mixture of aluminium alloy solder powder and rosin solder flux, it accords with ANSI-stb-004-006 standard, applicable to rework of mobile, PC, etc.
Characters:
1.Perfect performance in soldering
2.No-accosion to IC and PCB
3.Its boiling point is a little bit higher than melting point of tin, which helps to keep the stable temperature of IC and PCB as solder paste evaporate while tin melting.It's just like boiling water in pot.The pot couldn't be demaged by the high temperature with water left in it.